JPH0512077B2 - - Google Patents
Info
- Publication number
- JPH0512077B2 JPH0512077B2 JP10386688A JP10386688A JPH0512077B2 JP H0512077 B2 JPH0512077 B2 JP H0512077B2 JP 10386688 A JP10386688 A JP 10386688A JP 10386688 A JP10386688 A JP 10386688A JP H0512077 B2 JPH0512077 B2 JP H0512077B2
- Authority
- JP
- Japan
- Prior art keywords
- copper
- nickel
- rolling
- clad
- bonding surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 42
- 239000000463 material Substances 0.000 claims description 34
- 239000010949 copper Substances 0.000 claims description 21
- 229910052802 copper Inorganic materials 0.000 claims description 21
- 229910052759 nickel Inorganic materials 0.000 claims description 20
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 16
- 238000005096 rolling process Methods 0.000 claims description 13
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 229910000570 Cupronickel Inorganic materials 0.000 claims description 8
- YOCUPQPZWBBYIX-UHFFFAOYSA-N copper nickel Chemical compound [Ni].[Cu] YOCUPQPZWBBYIX-UHFFFAOYSA-N 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 5
- 238000000137 annealing Methods 0.000 claims description 3
- 238000009792 diffusion process Methods 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000007747 plating Methods 0.000 description 11
- 230000003647 oxidation Effects 0.000 description 4
- 238000007254 oxidation reaction Methods 0.000 description 4
- 238000007796 conventional method Methods 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 239000012300 argon atmosphere Substances 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000005097 cold rolling Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
Landscapes
- Metal Rolling (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10386688A JPH01278977A (ja) | 1988-04-28 | 1988-04-28 | 銅‐ニッケルクラッド材の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10386688A JPH01278977A (ja) | 1988-04-28 | 1988-04-28 | 銅‐ニッケルクラッド材の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01278977A JPH01278977A (ja) | 1989-11-09 |
| JPH0512077B2 true JPH0512077B2 (en]) | 1993-02-17 |
Family
ID=14365364
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10386688A Granted JPH01278977A (ja) | 1988-04-28 | 1988-04-28 | 銅‐ニッケルクラッド材の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01278977A (en]) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100276172B1 (ko) * | 1998-07-10 | 2000-12-15 | 전용수 | 니켈+인,니켈+붕소 또는 니켈+실리콘 도금층을 이용한 금속 접합방법 |
| WO2000077850A1 (en) * | 1999-06-10 | 2000-12-21 | Toyo Kohan Co., Ltd. | Clad plate for forming interposer for semiconductor device, interposer for semiconductor device, and method of manufacturing them |
-
1988
- 1988-04-28 JP JP10386688A patent/JPH01278977A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01278977A (ja) | 1989-11-09 |
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